IMPROVED INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT PACKAGE

Details for Australian Patent Application No. 2003278855 (hide)

Owner ASAT LIMITED MCLELLAN, Neil, Robert PEDRON, Serafin, Jr. YEE, Lin, Tsui

Inventors YEE, Lin, Tsui; PEDRON, Serafin, Jr.; MCLELLAN, Neil, Robert

Pub. Number AU-A-2003278855

PCT Number PCT/US2003/0200

PCT Pub. Number WO2004/001847

Priority 10/178,372 24.06.02 US

Filing date 24 June 2003

Wipo publication date 6 January 2004

International Classifications

H01L 023/48 Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

H01L 023/28 Details of semiconductor or other solid state devices - Encapsulation, e.g. encapsulating layers, coatings

H01L 029/40 Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier - Electrodes

H01L 023/52 Details of semiconductor or other solid state devices - Arrangements for conducting electric current within the device in operation from one component to another

H01L 023/495 Details of semiconductor or other solid state devices

Event Publications

26 February 2004 Complete Application Filed

  Priority application(s): 10/178,372 24.06.02 US

4 March 2004 Application Open to Public Inspection

  Published as AU-A-2003278855

14 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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