POLISHING APPARATUS

Details for Australian Patent Application No. 2003278606 (hide)

Owner EBARA CORPORATION

Inventors HAYAMA, Takuji; INOUE, Masafumi; SAKURAI, Kunihiko

Pub. Number AU-A-2003278606

PCT Number PCT/JP03/14057

PCT Pub. Number WO2004/041479

Priority 2002-320725 05.11.02 JP

Filing date 4 November 2003

Wipo publication date 7 June 2004

International Classifications

B24B 037/04 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped - designed for working plane surfaces

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

26 February 2004 Complete Application Filed

  Priority application(s): 2002-320725 05.11.02 JP

1 July 2004 Application Open to Public Inspection

  Published as AU-A-2003278606

21 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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