METHOD AND APPARATUS FOR DRYING SEMICONDUCTOR WAFER SURFACES USING A PLURALITY OF INLETS AND OUTLETS HELD IN CLOSE PROXIMITY TO THE WAFER SURFACES

Details for Australian Patent Application No. 2003277212 (hide)

Owner LAM RESEARCH CORPORATION

Inventors WOODS, Carl; RAVKIN, Mike; REDEKER, Fritz; BOYD, John; NICKHOU, Afshin; DE LARIOS, John, M.; GARCIA, James, P.

Pub. Number AU-A-2003277212

PCT Number PCT/US03/31136

PCT Pub. Number WO2004/030052

Priority 10/261,839 30.09.02 US; 10/611,140 30.06.03 US

Filing date 30 September 2003

Wipo publication date 19 April 2004

International Classifications

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

19 February 2004 Complete Application Filed

  Priority application(s): 10/261,839 30.09.02 US; 10/611,140 30.06.03 US

20 May 2004 Application Open to Public Inspection

  Published as AU-A-2003277212

14 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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