METHOD FOR ELIMINATING VOIDING IN PLATED SOLDER

Details for Australian Patent Application No. 2003277128 (hide)

Owner MOTOROLA, INC.

Inventors FAY, Owen

Pub. Number AU-A-2003277128

PCT Number PCT/US03/30860

PCT Pub. Number WO2004/034460

Priority 10/267,453 09.10.02 US

Filing date 30 September 2003

Wipo publication date 4 May 2004

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/288 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

19 February 2004 Complete Application Filed

  Priority application(s): 10/267,453 09.10.02 US

3 June 2004 Application Open to Public Inspection

  Published as AU-A-2003277128

14 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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