ATOMIC LAYER DEPOSITION METHODS AND ATOMIC LAYER DEPOSITION TOOLS

Details for Australian Patent Application No. 2003277064 (hide)

Owner MICRON TECHNOLOGY, INC.

Inventors SANDHU, Gurtej, S.; DOAN, Trung, Tri

Pub. Number AU-A-2003277064

PCT Number PCT/US03/30732

PCT Pub. Number WO2004/034443

Priority 10/267,467 08.10.02 US

Filing date 26 September 2003

Wipo publication date 4 May 2004

International Classifications

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/316 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C23C 016/455 Chemical deposition or plating by decomposition - characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber

Event Publications

19 February 2004 Complete Application Filed

  Priority application(s): 10/267,467 08.10.02 US

3 June 2004 Application Open to Public Inspection

  Published as AU-A-2003277064

14 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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