INTERLAYER DIELECTRIC AND PREAPPLIED DIE ATTACH ADHESIVE MATERIALS

Details for Australian Patent Application No. 2003276729 (hide)

Owner HENKEL LOCTITE CORPORATION

Inventors LIU, Puwei; YANG, Kang; JI, Qing; SANTOS, Benedicto, Delos; HUNEKE, James, T.

Pub. Number AU-A-2003276729

PCT Number PCT/US03/19052

PCT Pub. Number WO2003/107427

Priority 60/389,642 17.06.02 US

Filing date 17 June 2003

Wipo publication date 31 December 2003

International Classifications

H01L 029/02 Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier - Semiconductor bodies

Event Publications

19 February 2004 Complete Application Filed

  Priority application(s): 60/389,642 17.06.02 US

26 February 2004 Application Open to Public Inspection

  Published as AU-A-2003276729

14 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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