HEAT CONDUCTIVE SILICONE COMPOSITION

Details for Australian Patent Application No. 2003276704 (hide)

Owner DOW CORNING TORAY SILICONE CO., LTD.

Inventors FUKUI, Hiroshi

Pub. Number AU-A-2003276704

PCT Number PCT/JP03/13801

PCT Pub. Number WO2004/041938

Priority 2002-325895 08.11.02 JP

Filing date 28 October 2003

Wipo publication date 7 June 2004

International Classifications

C08L 083/04 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only

C08K 003/22 Use of inorganic ingredients

C08K 003/08 Use of inorganic ingredients

C08K 003/38 Use of inorganic ingredients

C09K 005/08 Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants

C10M 169/02 Mixtures of base-materials, thickeners and additives

H01L 023/373 Details of semiconductor or other solid state devices

Event Publications

19 February 2004 Complete Application Filed

  Priority application(s): 2002-325895 08.11.02 JP

1 July 2004 Application Open to Public Inspection

  Published as AU-A-2003276704

21 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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