A LEAD-FREE SOLDER, AND A LEAD-FREE JOINT

Details for Australian Patent Application No. 2003276701 (hide)

Owner KOA KABUSHIKI KAISHA

Inventors SUGIURA, Masahiro; OKABE, Saburo; KOBAYASHI, Satoru; KATO, Kazuyuki

Pub. Number AU-A-2003276701

PCT Number PCT/JP03/13511

PCT Pub. Number WO2004/038053

Priority 2002-309549 24.10.02 JP

Filing date 23 October 2003

Wipo publication date 13 May 2004

International Classifications

C22C 018/00 Alloys based on zinc

C23C 002/06 Coating by applying the coating material in the molten state - Zinc or cadmium or alloys based thereon

Event Publications

19 February 2004 Complete Application Filed

  Priority application(s): 2002-309549 24.10.02 JP

17 June 2004 Application Open to Public Inspection

  Published as AU-A-2003276701

14 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

25 August 2005 Corrigenda

  Applications OPI - Name Index Under the name KOA KABUSHIKI KAISHA, Application No. 2003276701, under INID (71) correct the name to read OKABE GIKEN CO., LTD.; KOA KABUSHIKI KAISHA; SOLDERCOAT CO., LTD.

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