POLISHING SLURRY AND POLISHED SUBSTRATE

Details for Australian Patent Application No. 2003275655 (hide)

Owner SHOWA DENKO K.K.

Inventors SAEGUSA, Hiroshi; IMAI, Fumio; ITO, Katsura

Pub. Number AU-A-2003275655

PCT Number PCT/JP03/13641

PCT Pub. Number WO2004/037943

Priority 2002-311212 25.10.02 JP; 60/423,376 04.11.02 US

Filing date 24 October 2003

Wipo publication date 13 May 2004

International Classifications

C09K 003/14 Materials not provided for elsewhere - Anti-slip materials

C09G 001/02 Polishing compositions

H01L 021/768 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

12 February 2004 Complete Application Filed

  Priority application(s): 2002-311212 25.10.02 JP; 60/423,376 04.11.02 US

17 June 2004 Application Open to Public Inspection

  Published as AU-A-2003275655

14 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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