RESIN MOLDED PRODUCT FOR ELECTRIC PARTS AND MANUFACTURING METHOD THEREOF

Details for Australian Patent Application No. 2003275594 (hide)

Owner FUJI ELECTRIC HOLDINGS CO., LTD.

Inventors YAJIMA, Asuka; KANNO, Toshiyuki

Pub. Number AU-A-2003275594

PCT Number PCT/JP03/13497

PCT Pub. Number WO2004/037904

Priority 2002-308111 23.10.02 JP; 2003-143952 21.05.03 JP

Filing date 22 October 2003

Wipo publication date 13 May 2004

International Classifications

C08J 007/00 Chemical treatment or coating of shaped articles made of macromolecular substances

C08L 101/00 Compositions of unspecified macromolecular compounds

C08J 003/20 Processes of treating or compounding macromolecular substances - Compounding polymers with additives, e.g. colouring

Event Publications

12 February 2004 Complete Application Filed

  Priority application(s): 2002-308111 23.10.02 JP; 2003-143952 21.05.03 JP

17 June 2004 Application Open to Public Inspection

  Published as AU-A-2003275594

14 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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