APPARATUS FOR AND METHOD OF WAFER GRINDING

Details for Australian Patent Application No. 2003275276 (hide)

Owner MOTOROLA, INC., A CORPORATION OF THE STATE OF DELAWARE

Inventors SCHNEEGANS, Manfred; ROESNER, Nichael; WALLIS, David

Pub. Number AU-A-2003275276

PCT Number PCT/US03/30589

PCT Pub. Number WO2004/043647

Priority 10/290,907 08.11.02 US

Filing date 23 September 2003

Wipo publication date 3 June 2004

International Classifications

B24B 007/22 Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces

B24B 049/12 Measuring - involving optical means

B24B 049/16 Measuring - taking regard of the load

Event Publications

12 February 2004 Complete Application Filed

  Priority application(s): 10/290,907 08.11.02 US

8 July 2004 Application Open to Public Inspection

  Published as AU-A-2003275276

21 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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