CRACK RESISTANT INTERCONNECT MODULE

Details for Australian Patent Application No. 2003275208 (hide)

Owner 3M INNOVATIVE PROPERTIES COMPANY

Inventors SATOU, Sadanobu; KIMURA, Teruhiko; GORRELL, Robin, E.; SYLVESTER, Mark, F.; BANKS, Donald, R.; HOLCOMB, Michael, D.; BALLARD, William, V.; HIROSAWA, Kouichi

Pub. Number AU-A-2003275208

PCT Number PCT/US03/30060

PCT Pub. Number WO2004/030096

Priority 10/668,881 23.09.03 US; 60/414,461 27.09.02 US; 10/668,881 23.09.03 US

Filing date 24 September 2003

Wipo publication date 19 April 2004

International Classifications

H01L 023/498 Details of semiconductor or other solid state devices

Event Publications

12 February 2004 Complete Application Filed

  Priority application(s): 10/668,881 23.09.03 US; 60/414,461 27.09.02 US; 10/668,881 23.09.03 US

20 May 2004 Application Open to Public Inspection

  Published as AU-A-2003275208

14 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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