Method of forming a through-substrate interconnect

Details for Australian Patent Application No. 2003275108 (hide)

Owner Hewlett-Packard Development Company, L.P.

Inventors Snyder, Barry C.; Hellekson, Ronald A.; Lai, Diane W.; Vander Plas, Hubert A.; Berhane, Samson

Agent Shelston IP

Pub. Number AU-B-2003275108

PCT Number PCT/US03/29807

PCT Pub. Number WO2005/036639

Filing date 17 September 2003

Wipo publication date 27 April 2005

Acceptance publication date 27 August 2009

International Classifications

H01L 23/48 (2006.01) Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leadsĀ or terminal arrangements

B41J 2/16 (2006.01) Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed - Production of nozzles

H01L 21/768 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

12 February 2004 Complete Application Filed

25 August 2005 Application Open to Public Inspection

  Published as AU-B-2003275108

27 August 2009 Application Accepted

  Published as AU-B-2003275108

24 December 2009 Standard Patent Sealed

23 December 2010 Assignment Registered

  Hewlett-Packard Development Company, L.P. The patent has been assigned to Samsung Electronics Co., Ltd.

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