Method of forming a through-substrate interconnect
Details for Australian Patent Application No. 2003275108 (hide)
International Classifications
Event Publications
12 February 2004 Complete Application Filed
25 August 2005 Application Open to Public Inspection
Published as AU-B-2003275108
27 August 2009 Application Accepted
Published as AU-B-2003275108
24 December 2009 Standard Patent Sealed
23 December 2010 Assignment Registered
Hewlett-Packard Development Company, L.P. The patent has been assigned to Samsung Electronics Co., Ltd.
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