METAL POLISH COMPOSITION, POLISHING METHOD USING THE COMPOSITION AND METHOD FOR PRODUCING WAFER USING THE POLISHING METHOD

Details for Australian Patent Application No. 2003274895 (hide)

Owner SHOWA DENKO K.K.

Inventors SATO, Takashi; NISHIOKA, Ayako; ITO, Daigo

Pub. Number AU-A-2003274895

PCT Number PCT/JP03/07182

PCT Pub. Number WO2003/104350

Priority 60/388,301 14.06.02 US; 2002-166436 07.06.02 JP

Filing date 6 June 2003

Wipo publication date 22 December 2003

International Classifications

C09K 003/14 Materials not provided for elsewhere - Anti-slip materials

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

12 February 2004 Complete Application Filed

  Priority application(s): 60/388,301 14.06.02 US; 2002-166436 07.06.02 JP

19 February 2004 Application Open to Public Inspection

  Published as AU-A-2003274895

14 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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