SEALING MATERIAL FOR SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION THEREOF

Details for Australian Patent Application No. 2003272956 (hide)

Owner ASAHI GLASS CO., LTD.

Inventors SUMI, Naoko; KAMIYA, Hiroki; OKAZAKI, Masanori; KOBAYASHI, Yukio; SAMURA, Yoshitaka

Pub. Number AU-A-2003272956

PCT Number PCT/JP03/12929

PCT Pub. Number WO2004/033580

Priority 2002-299388 11.10.02 JP; 2002-299389 11.10.02 JP

Filing date 9 October 2003

Wipo publication date 4 May 2004

International Classifications

C09K 003/10 Materials not provided for elsewhere - for sealing or packing joints or covers

C08F 214/18 Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen

C08L 027/12 Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen

F16J 015/10 Sealings - with non-metallic packing

Event Publications

22 January 2004 Complete Application Filed

  Priority application(s): 2002-299388 11.10.02 JP; 2002-299389 11.10.02 JP

3 June 2004 Application Open to Public Inspection

  Published as AU-A-2003272956

14 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

25 August 2005 Corrigenda

  Applications OPI - Name Index Under the name ASAHI GLASS CO., LTD., Application No. 2003272956, under INID (71) correct the name to read ASAHI GLASS CO., LTD.; NIPPON VALQUA INDUSTRIES, LTD.

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