SEMICONDUCTOR MULTI-PACKAGE MODULE HAVING WIRE BOND INTERCONNECTION BETWEEN STACKED PACKAGES

Details for Australian Patent Application No. 2003272405 (hide)

Event Publications

22 January 2004 Complete Application Filed

Priority application(s): 60/411,590 17.09.02 US; 10/632,549 02.08.03 US; 10/632,568 02.08.03 US; 10/632,552 02.08.03 US; 10/632,553 02.08.03 US; 10/632,550 02.08.03 US; 10/632,551 02.08.03 US

20 May 2004 Application Open to Public Inspection

Published as AU-A-2003272405

7 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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