CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR PROBE CARD ASSEMBLIES AND PACKAGES HAVING WAFER LEVEL SPRINGS

Details for Australian Patent Application No. 2003272205 (hide)

Event Publications

22 January 2004 Complete Application Filed

Priority application(s): 10/178,103 24.06.02 US

4 March 2004 Application Open to Public Inspection

Published as AU-A-2003272205

7 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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