Process for roughening surface of wafer

Details for Australian Patent Application No. 2003271172 (hide)

Owner Mimasu Semiconductor Industry Co., Ltd.

Inventors Tsuchiya, Masato; Ogasawara, Syunichi

Pub. Number AU-A-2003271172

PCT Number PCT/JP03/13058

PCT Pub. Number WO2005/036629

Filing date 10 October 2003

Wipo publication date 27 April 2005

International Classifications

H01L 021/306 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

15 January 2004 Complete Application Filed

25 August 2005 Application Open to Public Inspection

  Published as AU-A-2003271172

29 June 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2003271173-CELL GROWTH REGULATOR

2003271171-2,2-DI-SUBSTITUTED 1Alpha,25-DIHYDROXY-19-NORVITA MIN D DERIVATIVE