CONNECTION METHOD AND CONNECTION DEVICE

Details for Australian Patent Application No. 2003271061 (hide)

Owner TORAY ENGINEERING CO., LTD.

Inventors YAMAUCHI, Akira

Pub. Number AU-A-2003271061

PCT Number PCT/JP03/12144

PCT Pub. Number WO2004/028732

Priority 2002-278646 25.09.02 JP; 2002-364903 17.12.02 JP

Filing date 24 September 2003

Wipo publication date 19 April 2004

International Classifications

B23K 020/10 Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating - making use of vibrations, e.g. ultrasonic welding

B23K 020/24 Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating - Preliminary treatment

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/607 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

15 January 2004 Complete Application Filed

  Priority application(s): 2002-278646 25.09.02 JP; 2002-364903 17.12.02 JP

20 May 2004 Application Open to Public Inspection

  Published as AU-A-2003271061

30 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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