SEMICONDUCTOR DIE PACKAGE INCLUDING DRAIN CLIP

Details for Australian Patent Application No. 2003270700 (hide)

Owner FAIRCHILD SEMICONDUCTOR CORPORATION

Inventors MADRID, Ruben; QUINONES, Maria, Clemens, Y.

Pub. Number AU-A-2003270700

PCT Number PCT/US03/29142

PCT Pub. Number WO2004/032232

Priority 10/262,170 30.09.02 US

Filing date 17 September 2003

Wipo publication date 23 April 2004

International Classifications

H01L 023/48 Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

H01L 021/48 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/495 Details of semiconductor or other solid state devices

H01L 021/44 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

15 January 2004 Complete Application Filed

  Priority application(s): 10/262,170 30.09.02 US

27 May 2004 Application Open to Public Inspection

  Published as AU-A-2003270700

30 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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