WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP

Details for Australian Patent Application No. 2003269066 (hide)

Owner NATIONAL UNIVERSITY OF SINGAPORE

Inventors LU, Haijing; GONG, Hao; WONG, Chee, Khuen, Stephen

Pub. Number AU-A-2003269066

PCT Number PCT/SG03/00111

PCT Pub. Number WO2003/098681

Priority 60/378,049 16.05.02 US

Filing date 14 May 2003

Wipo publication date 2 December 2003

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/488 Details of semiconductor or other solid state devices

H01L 023/538 Details of semiconductor or other solid state devices

Event Publications

15 January 2004 Complete Application Filed

  Priority application(s): 60/378,049 16.05.02 US

29 January 2004 Application Open to Public Inspection

  Published as AU-A-2003269066

16 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

25 August 2005 Corrigenda

  Applications OPI - Name Index Under the name NATIONAL UNIVERSITY OF SINGAPORE, Application No. 2003269066, under INID (71) correct the name to read AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH; NATIONAL UNIVERSITY OF SINGAPORE

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