WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIP
Details for Australian Patent Application No. 2003269066 (hide)
International Classifications
Event Publications
15 January 2004 Complete Application Filed
Priority application(s): 60/378,049 16.05.02 US
29 January 2004 Application Open to Public Inspection
Published as AU-A-2003269066
16 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired
This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.
25 August 2005 Corrigenda
Applications OPI - Name Index Under the name NATIONAL UNIVERSITY OF SINGAPORE, Application No. 2003269066, under INID (71) correct the name to read AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH; NATIONAL UNIVERSITY OF SINGAPORE
Legal
The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.
Next and Previous Patents/Applications
2003269065-PURCHASING METHOD INITIATED BY A USER WITH THE AID OF A MOBILE TERMINAL
IP Reporting Samples
Customised IP Reporting
IP Insider for IP Professionals
IP Monitor Professional
- Editable Word format reports
- For IP Professionals
- Multiuser