EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR

Details for Australian Patent Application No. 2003268743 (hide)

Owner NIPPON KAYAKU KABUSHIKI KAISHA

Inventors KAWADA, Yoshihiro; UMEYAMA, Chie

Pub. Number AU-A-2003268743

PCT Number PCT/JP03/12677

PCT Pub. Number WO2004/031257

Priority 2002-290802 03.10.02 JP

Filing date 2 October 2003

Wipo publication date 23 April 2004

International Classifications

C08G 059/62 Polycondensates containing more than one epoxy group per molecule

H01L 023/29 Details of semiconductor or other solid state devices

Event Publications

8 January 2004 Complete Application Filed

  Priority application(s): 2002-290802 03.10.02 JP

27 May 2004 Application Open to Public Inspection

  Published as AU-A-2003268743

23 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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