ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS

Details for Australian Patent Application No. 2003267286 (hide)

Owner ENTHONE INC.

Inventors OWEI, Abayomi, I.; NGUYEN, Hiep, X.; YAKOBSON, Eric

Pub. Number AU-A-2003267286

PCT Number PCT/US03/29382

PCT Pub. Number WO2005/017229

Priority 10/619,198 14.07.03 US

Filing date 18 September 2003

Wipo publication date 7 March 2005

International Classifications

C23C 022/00 Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals

C23F 011/00 Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent

B05D 003/00 Pretreatment of surfaces to which liquids or other fluent materials are to be applied

B05D 003/10 Pretreatment of surfaces to which liquids or other fluent materials are to be applied - by other chemical means

B05D 007/14 Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials - to metal, e.g. car bodies

Event Publications

8 January 2004 Complete Application Filed

  Priority application(s): 10/619,198 14.07.03 US

14 April 2005 Application Open to Public Inspection

  Published as AU-A-2003267286

30 March 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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