JET SINGULATION OF A SUBSTRATE

Details for Australian Patent Application No. 2003267172 (hide)

Owner INTERCON TECHNOLOGY, INC.

Inventors SEO, Seill; JIANG, Shan; TAY, Steven

Pub. Number AU-A-2003267172

PCT Number PCT/US03/28743

PCT Pub. Number WO2004/025724

Priority 60/410,744 13.09.02 US

Filing date 12 September 2003

Wipo publication date 30 April 2004

International Classifications

H01L 021/78 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B24C 001/04 Methods for use of abrasive blasting for producing particular effects

B24C 009/00 Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

8 January 2004 Complete Application Filed

  Priority application(s): 60/410,744 13.09.02 US

20 May 2004 Application Open to Public Inspection

  Published as AU-A-2003267172

16 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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