Jack assembly

Details for Australian Patent Application No. 2003266790 (hide)

Owner ADC Telecommunications, Inc.

Inventors Sajadi, Ahmad; Dewey, James D; Henneberger, Roy Lee

Agent Phillips Ormonde Fitzpatrick

Pub. Number AU-B-2003266790

Parent 765854

Filing date 9 December 2003

Wipo publication date 15 January 2004

Acceptance publication date 21 July 2005

International Classifications

H01R 012/14 Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks

H01R 024/04 Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure

H01R 013/00 Details of coupling devices of the kinds covered by groups or

Event Publications

8 January 2004 Complete Application Filed

15 January 2004 Application Open to Public Inspection

  Published as AU-B-2003266790

21 July 2005 Application Accepted

  Published as AU-B-2003266790

17 November 2005 Standard Patent Sealed

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