SOLDER-COATED BALL AND METHOD FOR MANUFACTURE THEREOF, AND METHOD FOR FORMING SEMICONDUCTOR INTERCONNECTING STRUCTURE

Details for Australian Patent Application No. 2003266588 (hide)

Owner SUMITOMO SPECIAL METALS CO., LTD.

Inventors KONDO, Masuo; KIKUI, Fumiaki

Pub. Number AU-A-2003266588

PCT Number PCT/JP03/12183

PCT Pub. Number WO2004/030428

Priority 2002-283301 27.09.02 JP; 2002-291187 03.10.02 JP

Filing date 24 September 2003

Wipo publication date 19 April 2004

International Classifications

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

H01L 023/12 Details of semiconductor or other solid state devices - Mountings, e.g. non-detachable insulating substrates

Event Publications

18 December 2003 Complete Application Filed

  Priority application(s): 2002-283301 27.09.02 JP; 2002-291187 03.10.02 JP

20 May 2004 Application Open to Public Inspection

  Published as AU-A-2003266588

16 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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