SUBSTRATE PROCESSING APPARATUS

Details for Australian Patent Application No. 2003266564 (hide)

Owner TOKYO ELECTRON LIMITED

Inventors HORIGUCHI, Takahiro; KUWAJIMA, Ryo

Pub. Number AU-A-2003266564

PCT Number PCT/JP03/12084

PCT Pub. Number WO2004/030064

Priority 2002-278198 24.09.02 JP

Filing date 22 September 2003

Wipo publication date 19 April 2004

International Classifications

H01L 021/31 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C23C 016/46 Chemical deposition or plating by decomposition - characterised by the method used for heating the substrate

H05B 003/14 Ohmic-resistance heating - the material being non-metallic

H01L 021/02 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof -

Event Publications

18 December 2003 Complete Application Filed

  Priority application(s): 2002-278198 24.09.02 JP

20 May 2004 Application Open to Public Inspection

  Published as AU-A-2003266564

16 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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