BONDING DEVICE AND METHOD

Details for Australian Patent Application No. 2003266557 (hide)

Owner TORAY ENGINEERING CO., LTD. SUGA, Tadatomo

Inventors SUGA, Tadatomo; ITO, Toshihiro; YAMAUCHI, Akira

Pub. Number AU-A-2003266557

PCT Number PCT/JP03/12070

PCT Pub. Number WO2004/030076

Priority 2002-276986 24.09.02 JP

Filing date 22 September 2003

Wipo publication date 19 April 2004

International Classifications

B23K 020/24 Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating - Preliminary treatment

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

18 December 2003 Complete Application Filed

  Priority application(s): 2002-276986 24.09.02 JP

20 May 2004 Application Open to Public Inspection

  Published as AU-A-2003266557

16 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

25 August 2005 Corrigenda

  Applications OPI - Name Index Under the name TORAY ENGINEERING CO., LTD.; SUGA, Tadatomo, Application No. 2003266557, under INID (71) correct the name to read TORAY ENGINEERING CO., LTD.; SUGA, Tadatomo; OKI ELECTRIC INDUSTRY CO., LTD.; SANYO ELECTRIC CO., LTD.; SHARP KABUSHIKI KAISHA; SONY CORPORATION; KABUSHIKI KAISHA TOSHIBA; HITACHI, LTD.; FUJITSU LIMITED; MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.; MITSUBISHI DENKI KABUSHIKI KAISHA; ROHM CO., LTD.

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