COLLET, DIE BONDER, AND CHIP PICK-UP METHOD

Details for Australian Patent Application No. 2003266534 (hide)

Owner NEC MACHINERY CORPORATION

Inventors NAGAMOTO, Nobuhiro

Pub. Number AU-A-2003266534

PCT Number PCT/JP03/11936

PCT Pub. Number WO2005/029574

Filing date 18 September 2003

Wipo publication date 11 April 2005

International Classifications

H01L 021/52 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B25J 015/06 Gripping heads - with vacuum or magnetic holding means

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/68 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

18 December 2003 Complete Application Filed

26 May 2005 Application Open to Public Inspection

  Published as AU-A-2003266534

1 June 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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