CHIP SUPPORT OF A LEAD FRAME FOR AN INTEGRATED CIRCUIT PACKAGE

Details for Australian Patent Application No. 2003265206 (hide)

Owner INFINEON TECHNOLOGIES AG

Inventors YAZID, Mohamad, B., Wagiman; LOW MIN WEE, Pauline

Pub. Number AU-A-2003265206

PCT Number PCT/SG03/00201

PCT Pub. Number WO2005/022633

Filing date 29 August 2003

Wipo publication date 16 March 2005

International Classifications

H01L 023/495 Details of semiconductor or other solid state devices

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

18 December 2003 Complete Application Filed

28 April 2005 Application Open to Public Inspection

  Published as AU-A-2003265206

18 May 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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