Semiconductor Device and Method of Manufacturing the Same

Details for Australian Patent Application No. 2003264642 (hide)

Owner Ohmi, T.

Inventors Teramoto, Akinobu; Nii, Keiichi; Ohmi, Tadahiro; Akahori, Hiroshi; Sugawa, Shigetoshi

Agent Spruson & Ferguson

Pub. Number AU-B-2003264642

Priority 350177/2002 02.12.02 JP; 322170/2003 12.09.03 JP; 283560/2003 31.07.03 JP

Filing date 2 December 2003

Wipo publication date 17 June 2004

Acceptance publication date 6 August 2009

International Classifications

H01L 21/336 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 21/306 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 21/316 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 21/318 (2006.01) Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

18 December 2003 Complete Application Filed

  Priority application(s): 350177/2002 02.12.02 JP; 322170/2003 12.09.03 JP; 283560/2003 31.07.03 JP

17 June 2004 Application Open to Public Inspection

  Published as AU-B-2003264642

6 August 2009 Application Accepted

  Published as AU-B-2003264642

3 December 2009 Standard Patent Sealed

1 July 2010 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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