METHODS FOR DEPOSITING, RELEASING AND PACKAGING MICROELECTROMECHANICAL DEVICES ON WAFER SUBSTRATES

Details for Australian Patent Application No. 2003263744 (hide)

Owner REFLECTIVITY, INC.

Inventors PATEL, Satyadev; HUIBERS, Andrew; RICHARDS, Peter; SHI, Hongqin; CHIANG, Steve; DUBOC, Robert, Jr.; GROBELNY, Thomas; DEHLINGER, Dietrich; SUN, Anthony; CHEN, Hung, Nan

Pub. Number AU-A-2003263744

PCT Number PCT/US03/18741

PCT Pub. Number WO2003/105198

Priority 10/167,361 11.06.02 US; 10/167,361 11.06.02 US

Filing date 11 June 2003

Wipo publication date 22 December 2003

International Classifications

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/30 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/46 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/02 Details of semiconductor or other solid state devices - Containers

G02B 026/00 Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating

Event Publications

11 December 2003 Complete Application Filed

  Priority application(s): 10/167,361 11.06.02 US; 10/167,361 11.06.02 US

19 February 2004 Application Open to Public Inspection

  Published as AU-A-2003263744

9 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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