SOLDERING FILLER METAL, ASSEMBLY METHOD FOR SEMICONDUCTOR DEVICE USING SAME, AND SEMICONDUCTOR DEVICE

Details for Australian Patent Application No. 2003263597 (hide)

Owner SUMITOMO METAL MINING CO., LTD.

Inventors MORI, Nobuki; MORIMOTO, Kei

Pub. Number AU-A-2003263597

PCT Number PCT/JP03/11730

PCT Pub. Number WO2004/026527

Priority 2002-273598 19.09.02 JP

Filing date 12 September 2003

Wipo publication date 8 April 2004

International Classifications

B23K 035/26 Rods, electrodes, materials, or media, for use in soldering, welding, or cutting - with the principal constituent melting at less than 400°C

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

Event Publications

11 December 2003 Complete Application Filed

  Priority application(s): 2002-273598 19.09.02 JP

20 May 2004 Application Open to Public Inspection

  Published as AU-A-2003263597

2 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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