METHOD AND APPARATUS FOR ELECTROMECHANICALLY AND/OR ELECTROCHEMICALLY-MECHANICALLY REMOVING CONDUCTIVE MATERIAL FROM A MICROELECTRONIC SUBSTRATE

Details for Australian Patent Application No. 2003262996 (hide)

Owner MICRON TECHNOLOGY, INC.

Inventors LEE, Whonchee; MEIKLE, Scott, G.; MOORE, Scott, E.

Pub. Number AU-A-2003262996

PCT Number PCT/US03/27181

PCT Pub. Number WO2004/020148

Priority 10/230,970 29.08.02 US

Filing date 27 August 2003

Wipo publication date 19 March 2004

International Classifications

B24B 037/04 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped - designed for working plane surfaces

B23H 005/08 Combined machining

Event Publications

11 December 2003 Complete Application Filed

  Priority application(s): 10/230,970 29.08.02 US

6 May 2004 Application Open to Public Inspection

  Published as AU-A-2003262996

2 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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