A SOLDER INTERCONNECTION HAVING A LAYERED BARRIER STRUCTURE AND METHOD FOR FORMING SAME

Details for Australian Patent Application No. 2003262555 (hide)

Owner INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING

Inventors CHEN, William, T.; LI, Ming

Pub. Number AU-A-2003262555

PCT Number PCT/SG03/00094

PCT Pub. Number WO2003/092066

Priority 0202370-3 23.04.02 SG

Filing date 23 April 2003

Wipo publication date 10 November 2003

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

H01L 023/488 Details of semiconductor or other solid state devices

B23K 001/00 Soldering, e.g. brazing, or unsoldering

Event Publications

11 December 2003 Complete Application Filed

  Priority application(s): 0202370-3 23.04.02 SG

18 December 2003 Application Open to Public Inspection

  Published as AU-A-2003262555

2 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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