METHOD FOR CUTTING SEMICONDUCTOR SUBSTRATE

Details for Australian Patent Application No. 2003262077 (hide)

Owner HAMAMATSU PHOTONICS K.K.

Inventors FUKUMITSU, Kenshi; UCHIYAMA, Naoki; SUGIURA, Ryuji; FUKUYO, Fumitsugu

Pub. Number AU-A-2003262077

PCT Number PCT/JP03/11624

PCT Pub. Number WO2004/051721

Priority 2002-351600 03.12.02 JP

Filing date 11 September 2003

Wipo publication date 23 June 2004

International Classifications

H01L 021/301 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B28D 005/00 Fine working of gems, jewels, crystals, e.g. of semiconductor material

B23K 026/38 Working by laser beam, e.g. welding, cutting, boring

Event Publications

27 November 2003 Complete Application Filed

  Priority application(s): 2002-351600 03.12.02 JP

29 July 2004 Application Open to Public Inspection

  Published as AU-A-2003262077

18 August 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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