RESIST AND METHOD OF FORMING RESIST PATTERN

Details for Australian Patent Application No. 2003261921 (hide)

Owner NEC CORPORATION

Inventors OCHIAI, Yukinori; ISHIDA, Masahiko; FUJITA, Junichi; OGURA, Takashi; MOMODA, Junji; OSHIMA, Eiji

Pub. Number AU-A-2003261921

PCT Number PCT/JP03/11284

PCT Pub. Number WO2004/022513

Priority 2002-262314 09.09.02 JP

Filing date 4 September 2003

Wipo publication date 29 March 2004

International Classifications

C07C 043/225 Ethers

G03F 007/038 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Macromolecular compounds which are rendered insoluble or differentially wettable

G03F 007/004 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Photosensitive materials

Event Publications

27 November 2003 Complete Application Filed

  Priority application(s): 2002-262314 09.09.02 JP

13 May 2004 Application Open to Public Inspection

  Published as AU-A-2003261921

2 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

25 August 2005 Corrigenda

  Applications OPI - Name Index Under the name NEC CORPORATION, Application No. 2003261921, under INID (71) correct the name to read NEC CORPORATION; TOKUYAMA CORPORATION

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