WAFER BONDING OF THINNED ELECTRONIC MATERIALS AND CIRCUITS TO HIGH PERFORMANCE SUBSTRATES

Details for Australian Patent Application No. 2003261075 (hide)

Owner THE GOVERNMENT OF THE UNITED STATES OF AMERICA, as represented by THE SECRETARY OF THE NAVY

Inventors KUB, Francis, J.; HOBART, Karl, D.

Pub. Number AU-A-2003261075

PCT Number PCT/US03/16233

PCT Pub. Number WO2004/008486

Priority 60/395,340 12.07.02 US

Filing date 26 June 2003

Wipo publication date 2 February 2004

Event Publications

20 November 2003 Complete Application Filed

  Priority application(s): 60/395,340 12.07.02 US

18 March 2004 Application Open to Public Inspection

  Published as AU-A-2003261075

26 May 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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