High modulus, temperature-resistant film for form fill and seal packaging
Details for Australian Patent Application No. 2003259938 (hide)
International Classifications
Event Publications
20 November 2003 Complete Application Filed
Priority application(s): 10/225,815 21.08.02 US
22 April 2004 Application Open to Public Inspection
Published as AU-B-2003259938
30 October 2008 Application Accepted
Published as AU-B-2003259938
26 February 2009 Standard Patent Sealed
17 March 2011 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired
This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.
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