METHOD FOR FORMING BUMP ON ELECTRODE PAD WITH USE OF DOUBLE-LAYERED FILM

Details for Australian Patent Application No. 2003257647 (hide)

Owner JSR CORPORATION

Inventors OHTA, Masaru; INOMATA, Katsumi; IWANAGA, Shinichiro

Pub. Number AU-A-2003257647

PCT Number PCT/JP03/10569

PCT Pub. Number WO2004/019667

Priority 2002-242509 22.08.02 JP; 2003-23602 31.01.03 JP

Filing date 21 August 2003

Wipo publication date 11 March 2004

International Classifications

H05K 003/28 Apparatus or processes for manufacturing printed circuits - Applying non-metallic protective coatings

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

Event Publications

6 November 2003 Complete Application Filed

  Priority application(s): 2002-242509 22.08.02 JP; 2003-23602 31.01.03 JP

22 April 2004 Application Open to Public Inspection

  Published as AU-A-2003257647

19 May 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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