VERSATILE PROCESSES FOR PREPARING AND USING NOVEL COMPOSITE PARTICLES IN POWDER COATING COMPOSITIONS

Details for Australian Patent Application No. 2003256734 (hide)

Owner H.B. FULLER COMPANY

Inventors HECK, James, A.; LINDQUIST, Lowell, G.; BLATTER, Walter, J. HA, Jin-Wook see YUJINTECH21 CO., LTD. (21) 2002356463 HA, Jin-Wook see YUJINTECH21 CO., LTD. (21) 2002368127

Pub. Number AU-A-2003256734

PCT Number PCT/US03/23123

PCT Pub. Number WO2004/011531

Priority 10/206,482 26.07.02 US

Filing date 24 July 2003

Wipo publication date 16 February 2004

International Classifications

C08J 003/20 Processes of treating or compounding macromolecular substances - Compounding polymers with additives, e.g. colouring

C09D 005/03 Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced - Powdery paints

C08J 007/04 Chemical treatment or coating of shaped articles made of macromolecular substances

Event Publications

6 November 2003 Complete Application Filed

  Priority application(s): 10/206,482 26.07.02 US

25 March 2004 Application Open to Public Inspection

  Published as AU-A-2003256734

12 May 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2003256735-THERMOPLASTIC COMPOSITION HAVING LOW GLOSS APPEARANCE

2003256733-CONDUCTIVE INKS FOR METALIZATION IN INTEGRATED POLYMER MICROSYSTEMS