TREATING APPARATUS AND METHOD OF TREATING

Details for Australian Patent Application No. 2003254942 (hide)

Owner TOKYO ELECTRON LIMITED

Inventors KANNAN, Hiroshi; ISHIZAKA, Tadahiro; KOJIMA, Yasuhiko; OSHIMA, Yasuhiro; SHIGEOKA, Takashi

Pub. Number AU-A-2003254942

PCT Number PCT/JP03/10377

PCT Pub. Number WO2004/021415

Priority 2002-253674 30.08.02 JP

Filing date 15 August 2003

Wipo publication date 19 March 2004

International Classifications

H01L 021/02 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof -

H01L 021/285 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/31 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C23C 016/52 Chemical deposition or plating by decomposition - Controlling or regulating the coating process

C23C 016/455 Chemical deposition or plating by decomposition - characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber

Event Publications

30 October 2003 Complete Application Filed

  Priority application(s): 2002-253674 30.08.02 JP

6 May 2004 Application Open to Public Inspection

  Published as AU-A-2003254942

19 May 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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