MULTILAYER PRINTED WIRING BOARD AND PRODUCTION METHOD THEREFOR

Details for Australian Patent Application No. 2003254848 (hide)

Owner TAIYO YUDEN CO., LTD.

Inventors MIYAZAKI, Masashi; TAKAYAMA, Mitsuhiro; SAWATARI, Tatsuro; MUROTA, Takatoshi

Pub. Number AU-A-2003254848

PCT Number PCT/JP03/10049

PCT Pub. Number WO2004/017689

Priority 2002/237866 19.08.02 JP

Filing date 7 August 2003

Wipo publication date 3 March 2004

International Classifications

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

H05K 003/20 Apparatus or processes for manufacturing printed circuits - by affixing prefabricated conductor pattern

H05K 003/38 Apparatus or processes for manufacturing printed circuits - Improvement of the adhesion between the insulating substrate and the metal

Event Publications

30 October 2003 Complete Application Filed

  Priority application(s): 2002/237866 19.08.02 JP

22 April 2004 Application Open to Public Inspection

  Published as AU-A-2003254848

5 May 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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