Pressure contact spring for a contact arrangement in a power semiconductor module

Details for Australian Patent Application No. 2003254681 (hide)

Owner Abb Schweiz Ag

Inventors Assal, Jerome; Herr, Egon

Pub. Number AU-A-2003254681

PCT Number PCT/CH03/00569

PCT Pub. Number WO2005/020383

Filing date 22 August 2003

Wipo publication date 10 March 2005

International Classifications

H01R 013/33 Details of coupling devices of the kinds covered by groups or

H01R 013/24 Details of coupling devices of the kinds covered by groups or

H01L 023/48 Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

Event Publications

30 October 2003 Complete Application Filed

25 August 2005 Application Open to Public Inspection

  Published as AU-A-2003254681

11 May 2006 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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