ELECTRONIC PACKAGE SUBSTRATE WITH BACK SIDE, CAVITY MOUNTED CAPACITORS AND METHOD OF FABRICATION THEREFOR

Details for Australian Patent Application No. 2003254230 (hide)

Owner INTEL CORPORATION

Inventors FIGUEROA, David; BALDWIN, Chris; LI, Yuan-Liang

Pub. Number AU-A-2003254230

PCT Number PCT/US03/23570

PCT Pub. Number WO2004/012266

Priority 10/210,391 31.07.02 US

Filing date 24 July 2003

Wipo publication date 16 February 2004

International Classifications

H01L 025/16 Assemblies consisting of a plurality of individual semiconductor or other solid state devices - the devices being of types provided for in two or more different main groups of groups , e.g. forming hybrid circuits

H01L 023/64 Details of semiconductor or other solid state devices

Event Publications

30 October 2003 Complete Application Filed

  Priority application(s): 10/210,391 31.07.02 US

25 March 2004 Application Open to Public Inspection

  Published as AU-A-2003254230

5 May 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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