THERMOCONDUCTIVE FILLER, THERMOCODUCTIVE SILICONE ELASTOMER COMPOSITION, AND SEMICONDUCTOR DEVICES

Details for Australian Patent Application No. 2003253429 (hide)

Owner DOW CORNING TORAY SILICONE CO., LTD.

Inventors YAMAKAWA, Kimio; NAKAYOSHI, Kazumi; ISHIKAWA, Hiroki; MINE, Katsutoshi

Pub. Number AU-A-2003253429

PCT Number PCT/JP03/10035

PCT Pub. Number WO2004/015002

Priority 2002-229820 07.08.02 US

Filing date 6 August 2003

Wipo publication date 25 February 2004

International Classifications

C08K 009/04 Use of pretreated ingredients

C08L 063/00 Compositions of epoxy resins

Event Publications

30 October 2003 Complete Application Filed

  Priority application(s): 2002-229820 07.08.02 US

8 April 2004 Application Open to Public Inspection

  Published as AU-A-2003253429

28 April 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2003253430-FILLED SKUTTERUDITE-BASED ALLOY, PRODUCTION METHOD THEREOF AND THERMOELECTRIC CONVERSION DEVICE FABRICATED USING THE ALLOY

2003253428-NONVOLATILE MEMORY DEVICE