DEPOSITING SOLID MATERIALS

Details for Australian Patent Application No. 2003252969 (hide)

Owner QINETIQ LIMITED

Inventors JOHNSON, Daniel, Robert; DAMERELL, William, Norman

Pub. Number AU-A-2003252969

PCT Number PCT/GB03/03375

PCT Pub. Number WO2004/017688

Priority 0219091.6 16.08.02 GB

Filing date 4 August 2003

Wipo publication date 3 March 2004

International Classifications

H05K 003/10 Apparatus or processes for manufacturing printed circuits - in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

B41J 002/01 Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed - Ink jet

H01M 006/40 Primary cells - Printed batteries

H05K 003/18 Apparatus or processes for manufacturing printed circuits - using precipitation techniques to apply the conductive material

C23C 018/16 Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating - by reduction or substitution, i.e. electroless plating

Event Publications

30 October 2003 Complete Application Filed

  Priority application(s): 0219091.6 16.08.02 GB

22 April 2004 Application Open to Public Inspection

  Published as AU-A-2003252969

5 May 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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