TIN-SILVER-COPPER PLATING SOLUTION, PLATING FILM CONTAINING THE SAME, AND METHOD FOR FORMING THE PLATING FILM

Details for Australian Patent Application No. 2003252677 (hide)

Owner SHINRYO ELECTRONICS CO., LTD.

Inventors SONODA, Hiromi; NAKAMURA, Katsuji

Pub. Number AU-A-2003252677

PCT Number PCT/JP03/09351

PCT Pub. Number WO2004/011698

Priority 2002-216881 25.07.02 JP; 2002-296460 09.10.02 JP

Filing date 23 July 2003

Wipo publication date 16 February 2004

International Classifications

C25D 003/56 Electroplating - of alloys

C25D 007/00 Electroplating characterised by the article coated

C25D 017/10 Constructional parts, or assemblies thereof, of cells for electrolytic coating - Electrodes

C25D 017/12 Constructional parts, or assemblies thereof, of cells for electrolytic coating

C25D 005/18 Electroplating characterised by the process

Event Publications

16 October 2003 Complete Application Filed

  Priority application(s): 2002-216881 25.07.02 JP; 2002-296460 09.10.02 JP

25 March 2004 Application Open to Public Inspection

  Published as AU-A-2003252677

28 April 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2003252678-Dual roll casting machine

2003252676-PREVENTIVE FOR THE ONSET OF DIABETES