PROCESS FOR ETCHING DIELECTRIC FILMS WITH IMPROVED RESIST AND/OR ETCH PROFILE CHARACTERISTICS

Details for Australian Patent Application No. 2003251519 (hide)

Owner LAM RESEARCH CORPORATION

Inventors EPPLER, Aaron; SRINIVASAN, Mukund; CHEBI, Robert

Pub. Number AU-A-2003251519

PCT Number PCT/US03/18791

PCT Pub. Number WO2003/107410

Priority 10/170,424 14.06.02 US

Filing date 13 June 2003

Wipo publication date 31 December 2003

International Classifications

H01L 021/311 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

16 October 2003 Complete Application Filed

  Priority application(s): 10/170,424 14.06.02 US

26 February 2004 Application Open to Public Inspection

  Published as AU-A-2003251519

21 April 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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