SILICONE-BASED ADHESIVE SHEET, METHOD OF BONDING A SEMICONDUCTOR CHIP TO A CHIP ATTACHMENT COMPONENT, AND A SEMICONDUCTOR DEVICE

Details for Australian Patent Application No. 2003249594 (hide)

Owner DOW CORNING TORAY SILICONE CO., LTD.

Inventors USHIO, Yoshito; FUJISAWA, Toyohiko; MINE, Katsutoshi; SUTOH, Manabu

Pub. Number AU-A-2003249594

PCT Number PCT/JP03/08936

PCT Pub. Number WO2004/007628

Priority 2002-205869 15.07.02 JP

Filing date 14 July 2003

Wipo publication date 2 February 2004

International Classifications

C09J 007/02 Adhesives in the form of films or foils - on carriers

C09J 183/04 Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only

H01L 021/58 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

16 October 2003 Complete Application Filed

  Priority application(s): 2002-205869 15.07.02 JP

18 March 2004 Application Open to Public Inspection

  Published as AU-A-2003249594

7 April 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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